Transistor is a fundamental component in electronics and logic circuits, used for switching and amplification. MOSFET is a type of field-effect transistor (FET) whose gate is electrically insulated using an oxide layer, also called IGFET (Insulated Gate FET).
MOSFET, or Metal-Oxide-Semiconductor Field-Effect Transistor, is a four-terminal FET: drain, gate, source, and body/substrate. The body terminal is shorted to the source, leaving three working terminals like any other transistor.
MOSFET conducts current between the source and drain through a channel, whose width is controlled by the gate voltage. MOSFET is a voltage-controlled device. A thin silicon dioxide layer isolates the gate from the channel, significantly increasing input impedance to the megaohm range. Thus, no gate current flows.
MOSFETs are mainly classified as:
* Depletion MOSFET (D-MOSFET)
* Enhancement MOSFET (E-MOSFET)
Both types can be N-channel or P-channel.
* D-MOSFETs are “normally ON” with a built-in channel; applying gate voltage reduces channel width to turn OFF.
* MOSFETs are “normally OFF”; the channel is induced by applied voltage.
Symbols:
* D-MOSFET: continuous line between drain and source = current flows at VGS = 0
* E-MOSFET: broken line = no current flow at VGS = 0
* Arrow direction: inward = N-channel, outward = P-channel
MOSFET acts as an insulator or conductor based on small signals and works in three regions:
* Cutoff Region: MOSFET is OFF, drain current ID = 0; used as switch OFF state
* Saturation Region: Constant current flows; MOSFET fully ON; maximum drain current ID
* Linear / Ohmic Region: Provides controlled resistance; drain current varies with VDS and is controlled by VGS; used for amplification
MOSFETs are divided into:
* Depletion-mode MOSFET (D-MOSFET) – N & P channel
* Enhancement-mode MOSFET (E-MOSFET) – N & P channel
D-MOSFET has a built-in channel during fabrication, so it conducts even at VGS = 0 V. Reverse-bias gate depletes carriers and narrows the channel until it stops conducting, defined by threshold voltage VTH.
Forward-bias gate induces more majority carriers, widening the channel and increasing drain current ID.
Key points:
* D-MOSFET can operate in depletion or enhancement mode
* N or P channel affects bias, speed, and current capacity
Source and drain are placed on an N-type layer; the gate electrode is placed on top of a metal oxide insulating layer.
The channel is made of N-type material; electrons are the majority carriers.
* Negative VGS < 0 V: holes in P-substrate deplete electrons, narrowing channel; MOSFET stops conducting at VGS = -VTH
* Positive VGS: enhances conductivity; drain current ID increases with VDS in linear region and saturates at IDSS when VDS reaches pinch-off voltage VP
* Cutoff Region:VGS≤−VTH. Drain currentID=0, MOSFET is OFF.
* Saturation Region:VGS>−VTH,VDS>VP. Maximum drain currentIDSS flows, depending onVGS.
* Linear / Ohmic Region:VGS>−VTH,VDS<VP. MOSFET acts as an amplifier;ID increases withVDS, gain depends onVGS.
P-Channel D-MOSFET has the same structure as N-channel, except source and drain are on P-type layer. Channel is made on N-type substrate, carriers are holes.
* Holes are heavier than electrons → lower speed
* Gate voltage controls channel width and current
* Positive VGS: depletes carriers, narrows channel, reduces current
* Negative VGS: induces more holes, enhancing current
* Cutoff Region:VGS=+VTH,ID=0, MOSFET OFF
* Saturation Region:VGS<+VTH,VDS>VP, maxIDSS flows
* Linear / Ohmic Region:VGS<+VTH,VDS<VP, acts as amplifier;ID increases withVDS, gain depends onVGS
Enhancement MOSFET has no built-in channel; channel is induced by gate voltage, enhancing conduction.
* No gate voltage: MOSFET is OFF → “normally OFF”
* VGS > VTH: channel forms, current flows
* Channel width increases with higher VGS → drain current increases
Types: N-Channel and P-Channel E-MOSFET
Structure similar to D-MOSFET, but no built-in channel.
* VGS=0 → non-conductive
* Positive VGS creates electric field, attracts electrons from P-substrate, repels holes, forming induced channel
* Channel forms at VGS ≥ VTH, width increases with VGS
* Cutoff Region:VGS≤0V,ID=0, works as switch OFF
* Saturation Region:VGS>0V,VDS>VGS, maximum drain currentIDSS flows
* Linear / Ohmic Region:VGS>0V,VDS<VGS, acts as amplifier;ID rises withVDS depending on VGS
P-Channel E-MOSFET is similar to P-Channel D-MOSFET but no channel at fabrication.
* Negative VGS induces holes under the insulating layer, forming a channel
* Voltage applied between source and drain enables current
* Channel width depends on VGS; current increases as VGS decreases below VTH
* Cutoff Region:VGS≥0V, no drain currentID=0, MOSFET OFF
* Saturation Region:VGS<0V,VDS>VGS, maximum drain currentIDSS flows, depends on VGS level
* Linear / Ohmic Region:VGS<0V,VDS<VGS, MOSFET acts as amplifier; ID rises with VDS, gain depends on VGS
Explanation: P-Channel E-MOSFET behaves similarly to N-Channel E-MOSFET but with reversed voltage polarities. At VGS = 0V, it is non-conductive; applying negative VGS induces a channel allowing current flow.
MOSFET can operate as a switch or amplifier. Its operation depends on type and bias; it can work in depletion or enhancement mode.
* An insulating layer between gate and channel increases input impedance → no gate current flows
* Acts on voltage applied to gate terminal
* Insulating layer forms a flat capacitor → very high input impedance, very low power consumption, but vulnerable to static damage
Depletion Mode:
* Built-in channel exists; applying VDS allows drain current ID
* Reverse-bias VGS depletes carriers, narrows channel, reducing or stopping current
Enhancement Mode:
* Forward-bias VGS attracts carriers, increasing channel width
* Higher VGS → more charge accumulation → wider channel → higher ID
Table: Four MOSFET types, VGS levels, threshold voltage VTH, pinch-off voltage VP
* Depletion MOSFET: works in both depletion and enhancement mode
* Enhancement MOSFET: only works in enhancement mode
* Drain and source can be interchangeable; drain is the higher voltage end
* Transfer Characteristics: Shows relationship between input gate voltage VGS and output drain current ID
* Drain Characteristics: Shows relationship between drain-source voltage VDS and drain current ID
Transfer Curve: When VGS exceeds VTH, MOSFET conducts ID; threshold voltage < 0V → conducts at 0V-GS
Drain Characteristics: Shows three regions – cutoff, ohmic, saturation; includes depletion and enhancement modes
* Ohmic and saturation regions separated by pinch-off line; pinch-off voltage = minimum voltage for saturation
* Ohmic: ID increases with VDS
* Saturation: ID constant, varies only with VGS
* Cutoff: ID = 0, requires VGS below -VTH
* VGS = 0V → depletion mode; channel width and conductivity decrease with voltage
* VGS > 0V → enhancement mode; conductivity increases
Transfer Curve: Negative slope; MOSFET conducts when VGS < +VTH
Drain Characteristics: Shows VDS vs ID at different VGS; as VGS decreases, ID increases
* Voltage polarity reversed compared to N-channel; otherwise similar
* No conduction at VGS = 0V due to absence of channel
* Once VGS > VTH → conducts, same operation as D-MOSFET in enhancement mode
* Cutoff: VGS < VTH → ID = 0
* Ohmic: VGS > VTH, ID increases with VDS
* Saturation: VDS crosses pinch-off voltage VP → ID saturates
* Same characteristics as N-Channel E-MOSFET, voltage polarities reversed
* VGS < 0 → channel forms → current flows
* VGS = 0 → non-conductive
Advantages:
* No gate current, very high input impedance
* Extremely low leakage → negligible power consumption
* High switching speed → suitable for high-frequency applications
* Very low output resistance, small size
* Can operate in depletion or enhancement mode
* High efficiency at low voltage, voltage-controlled device, low power
* Unipolar → noiseless operation
Disadvantages:
* Gate-channel capacitance can be damaged by static
* Cannot withstand high voltage
* More expensive than BJT
MOSFETs are widely used in switching and amplification:
* Fast switching and amplification of very small signals, e.g., high-frequency amplifiers
* Power MOSFETs for DC motor control
* Suitable for chopper circuits due to high switching speed
* Digital ICs like microcontrollers and processors for superior switching speed and low power
* Switch-Mode Power Supplies (SMPS)
* CMOS logic circuits (combination of P-MOS and N-MOS layers)
* H-bridge circuits
* Buck and boost converters