Product Overview：

The HYNIX H9HCNNNCPUMLXR-NEE is a high-performance embedded Multi-Chip Package (eMCP) combining LPDDR4 DRAM and eMMC flash memory in a single compact module. Designed for smartphones, tablets, and industrial mobile applications, it provides high-speed memory access, large storage capacity, and energy-efficient operation.

Key Features:

Capacity: 128GB total storage combining DRAM and eMMC.

LPDDR4 DRAM: High-speed memory for responsive system performance.

eMMC Flash: Non-volatile storage supporting fast read/write operations.

High-Speed Operation: Optimized for demanding mobile and industrial applications.

Compact Multi-Chip Package (MCP): Saves PCB space and simplifies system integration.

Low Power Consumption: Efficient for battery-powered devices.

Industrial-Grade Reliability: Designed to operate under extended temperature and harsh conditions.

Applications:

Smartphones and tablets

Embedded mobile devices

Industrial IoT systems

Portable media players

Automotive infotainment systems

Wearable electronics