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CXMT CXDB4CBAM-MK-A STOCK

The CXDB4CBAM-MK-A is a low-power, high-speed SDRAM (Synchronous Dynamic Random-Access Memory) device manufactured by ChangXin Memory Technologies (CXMT) , a leading Chinese DRAM developer. Designed for mobile and embedded applications, this device integrates 16 Gigabits (2 Gigabytes) of memory in a compact FBGA-200 (Fine-Pitch Ball Grid Array) package.

Overview (Abstract):

The CXDB4CBAM-MK-A is a low-power, high-speed SDRAM (Synchronous Dynamic Random-Access Memory) device manufactured by ChangXin Memory Technologies (CXMT) , a leading Chinese DRAM developer. Designed for mobile and embedded applications, this device integrates 16 Gigabits (2 Gigabytes) of memory in a compact FBGA-200 (Fine-Pitch Ball Grid Array) package .

Operating from a 1.7V to 1.95V power supply for I/O and a 1.1V core voltage, the CXDB4CBAM-MK-A implements the LPDDR4X interface standard. It achieves a maximum clock frequency of 1.866 GHz, supporting data rates up to 3733 Mbps per pin . The device is specified for an operating temperature range of -25°C to +85°C .

Market Status: Please note that this part number is listed as "Discontinued" or "End of Life" by major component distributors . It is recommended to verify availability with authorized suppliers or consider newer CXMT LPDDR4X offerings for new designs.

Features:

Category: Specifications

Memory Type :LPDDR4X SDRAM (Low Power Double Data Rate 4X)

Memory Density: 16 Gbit (2 GByte) 

Clock Frequency: 1.866 GHz (LPDDR4X-3733) 

Data Transfer Rate: Up to 3733 Mbps per pin 

I/O Voltage (VDDQ): 1.7V – 1.95V 

Core Voltage (VDD): 1.1V (typical) 

Package Type: FBGA-200 (Fine-Pitch Ball Grid Array) 

Package Dimensions: 7.3 mm × 4.3 mm × 2 mm (approx.) 

Operating Temperature: -25°C to +85°C 

Interface: Parallel

RoHS Status: Compliant 

Lifecycle Status: Obsolete / End of Life (EOL) 

Applications:

The CXDB4CBAM-MK-A is suitable for a variety of memory-intensive applications requiring low power consumption and high bandwidth:

Mobile Devices: Smartphones and tablets requiring high-density, low-power memory 

Industrial Embedded Systems: Industrial control systems and embedded computing platforms 

IoT Devices: Smart IoT gateways and edge computing devices 

Automotive Electronics: Infotainment systems and digital instrument clusters 

Networking Equipment: Communications infrastructure requiring high-speed memory buffering

Design Recommendation: As this device has been discontinued, the CXDB5CCBM-ML (4GB) or CXDB5CCBM-MK-A (4GB) may serve as higher-density alternatives for new designs within the CXMT LPDDR4X family


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