Description:
The GD30DRE230x device integrates a 32-bitCortex®-M23 core MCU and a three-phase gatedriver. The device supports multiple applications,such as motors, electronic bikes, power tools, etc.The device provides up to 64 KB on-chip flashmemory and up to 8 KB SRAM memory. Anextensive range of enhanced I/O and peripheralsconnected to two APB buses. The devices offerone 12-bit ADC, a comparator, up to four general16-bit timers, a PWM advanced timer, as well as standard communication interfaces: SPI, I2C, USART,I2S.
The driver of GD30DRE230x includes three half-bridgedrivers, each is capable to driving two NMOSFETs andsupports up to 1A source and 1.2A sink current capability.The drive currents will be adapted automatically to theoptimized current according to different power MOSFETused in the application. A proprietary slew rate control isimplemented to reduce the EMI of gate drive. Aregulated charge pump supporting 100% duty cycle isintegrated in the device to supply the gate drive currentand the internal LDOs.The device inserts fixed dead-time and uses automatichandshaking to prevent the high-side and low-sideMOSFET from shoot-through when switching.The GD30DRE230x device supports system dataprocessing, daily transaction processing, highperformance control calculation, driving MOSFET. It canbe used in a broad range of applications, such as 3-phase BLDC/PMSM motors, electronic bikes, powertools.
Features:
System core– Integrated 32-bit low power consumptionARM Cortex-M23– Integrated nested vectored interruptcontroller– Up to 72 MHz operation frequency– Single-period multiplier
Memory map– Up to 64 Kbytes of flash memory with erase/program protection and read protection– Up to 8 Kbytes of SRAM with hardwareparity checking– Up to 3 Kbytes information block for the bootloader– 16 bytes option bytes block for userapplication requirements
Clock control– Internal 8MHz/28MHz/40K RC oscillator– A high-speed crystal oscillator (HXTAL)– A low-speed crystal oscillator (LXTAL)– A Phase Lock Loop 8-bit
Power and reset– Three power domains: VBAK, VDD / VDDAand 1.2V power domains– Three power saving modes: sleep, deepsleep and standby modes– Low voltage detector– Reset as power on and power down
Hardware CRC calculation by 7/8/16/32bitCRC code.
Up to 18 high-speed IO and support forexternal interrupt / event controller
DMA of 5 channels and each channel areconfigurable
Rail-to-rail low-power comparator withmultiple configurable
Free watchdog timer with IRC 40KHz andwindow watchdog timer
Infrared ray port for infrared ray remote control
Serial wire debug and trace functions.
Real-time clock include data and year
12-bit successive approximation ADC
8 external analog inputs, 1 channel for internaltemperature sensor, 1 channel for internalreference voltage
Start conversion by software/hardware trigger
Module supply requirements: 2.4V to 3.6V
Dual clock domain architecture
Maximum 2MHz conversion rate
Timer– Multiple output compared, input capture, PWMmode or single pulse mode channels– Hall sensor function and Quadrature decoder– Multiple counter modes or up counter modes– Break input– Channel output complementary PWM withprogram dead time– Timer master-slave management
Communication interfaces– I2C interfaces with a frequency of up to 1MHzMHz– SPI interfaces support 4 to 16 bits data size– I2S interfaces with a frequency of up to 192KHz– USRAT with operating frequency up to 9 MB/s
Motor driver– Smart high-side and low-side Slew-Rate Control– Gate drive current, peak 1A source and 1.2A sinkcurrent– 6x PWM input control up to 200KHz– 3.3V and 5V digital interface– Integrated 5V LDO– Dead time insertion– MOSFET Shoot-Through protection– Over temperature protection– Fault diagnostics– VP and VDD under voltage lock-out
Application:
Brushless DC motor control
Permanent magnet synchronous motorcontrol
Asynchronous motor control
Servo motor control
Robotics and RC toys
Industrial automation
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