Overview:

The GD32F10x adopts the Cortex®-M3 core, with a main frequency as high as 108MHz. The on-chip flash memory capacity ranges from 256KB to 1024KB, and the SRAM is either 64KB or 96KB. The CPU can access the flash memory and execute code at high speed with zero wait, and the execution efficiency is 30% to 40% higher than similar products in the market. The working performance at the maximum main frequency can reach 110 DMIPS.

This series integrates 5 UArts, 3 SPIs, 2 I2C interfaces and supports 8/16-bit external bus expansion. The analog peripherals provide up to 3 ADCs and 2 Dacs, as well as full-speed USB OTG interfaces, two CAN2.0B interfaces, and 10/100M Ethernet. The 8/16-bit external bus interface (EXMC) can also support various static memory expansions such as SRAM, NOR Flash, and NAND Flash, enhancing the support for device interconnection and control applications, and meeting the requirements of various standard connection functions such as information transmission and human-machine interface. There are a total of five packaging types to meet the increasingly diversified market application trends.

The GD32F103 product series supports CAN2.0B, USB FS, I2S and SDIO. Its main frequency is as high as 108MHz, supporting up to 3072KB of Flash and 96KB of SARM. It also integrates USART+UART, I2C, SPI, EXMC (External Memory Controller), and other digital and analog peripheral resources. The GD32F103 product series offers package options of QFN36, LQFP48, LQFP64, LQFP100 and LQFP144.