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GigaDevice GDQ2BFAA-CE Datesheet

The GigaDevice GDQ2BFAA-CE is a high-performance NOR flash memory device designed for reliable, fast, and energy-efficient data storage in embedded and industrial systems. It features high endurance, low power consumption, and stable operation across a wide temperature range. This datasheet provides detailed technical specifications, interface information, and performance characteristics, making it suitable for use in consumer electronics, automotive systems, IoT devices, and other applications requiring dependable non-volatile memory solutions.

FEATURES:

◆ Power supply: VDD = VDDQ = 1.2V (1.14V to 1.26V); VPP = 2.5V (2.375V to 2.75V)

◆ JEDEC standard package: 96-Ball FBGA (x16)

◆ Array Configuration: 8 Banks (x16) 2 groups of 4 banks

◆ 8n-Bit prefetch architecture

◆ Burst Length (BL): 8 and 4 with Burst Chop (BC)

◆ Programmable CAS Latency (CL)

◆ Programmable CAS Write Latency (CWL)

◆ Internal generated VREF for data inputs

◆ Data Mask (DM) for write data

◆ On-Die Termination (ODT): Support Nominal, Park and Dynamic ODT

◆ Interface: 1.2V Pseudo Open Drain (POD) IO

◆ Differential clock and data strobe inputs (CK_t ,CK_c; DQS_t, DQS_c)

◆ Per DRAM Addressability (PDA)

◆ Data Bus Inversion (DBI)

◆ Asynchronous reset for power up

◆ Maximum Power Saving Mode (MPSM)

◆ Precharge: Auto precharge option for each burst access

◆ Operating case temperature: -40°C ≤ TCASE ≤ 95°C

◆ Support auto-refresh and self-refresh mode

◆ Average Refresh Period:

-7.8μs at -40°C ≤ TCASE ≤ 85°C

-3.9μs at 85°C < TCASE ≤ 95°C

◆ Fine granularity refresh 2x, 4x mode for smaller tRFC

◆ Programmable data strobe preambles

◆ Command Address (CA) Parity is supported

◆ Write Cyclic Redundancy Code (CRC) is supported

◆ Connectivity test mode (TEN) is supported

◆ Gear Down Mode

◆ Output driver calibration through ZQ pin (RZQ: 240ohm ± 1%)

◆ JEDEC JESD-79-4D compliant

◆ RoHS compliant


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