Description：

Fifth Generation HEXFETs from International Rectifierutilize advanced processing techniques to achieveextremely low on-resistance per silicon area. Thisbenefit, combined with the fast switching speed and ruggedizeddevicedesign that

HEXFET Power MOSFET Sarewell knownfor. provides the desianer with an extremely efficient and reliable device for use in a wide variety ofa pplications.The D2Pak is a surface mount power package capable ofaccommodating die sizes up to HEX-4. lt provides thehighest power capability and the lowest possible onresistance in any existing surface mount package. TheD2Pakis suitable for high current applications because ofits low internal connection resistance and can dissipateup to 2.0W in a typical surface mount application.The through-hole version(lRF5305L)is available forlowprofile applications.

Features:

• Lead-Free

• Advanced Process Technology

• Surface Mount(lRF5305S)

• Low-profile through-hole(IRF5305L)

• 175°C Operating Temperature

•  Fast Switching

•  P-Channel

•  Fully Avalanche Rated