Features: 

• VDD = VDDQ = 1.2V ±60mV

• VPP = 2.5V, –125mV, +250mV

• On-die, internal, adjustable VREFDQ generation

• 1.2V pseudo open-drain I/O

• Refresh time of 8192-cycle at TC temperature range:

– 64ms at -40°C to 85°C

– 32ms at >85°C to 95°C

– 16ms at >95°C to 105°C

• 16 internal banks (x4, x8): 4 groups of 4 banks each

• 8 internal banks (x16): 2 groups of 4 banks each

• 8n-bit prefetch architecture

• Programmable data strobe preambles

• Data strobe preamble training

• Command/Address latency (CAL)

• Multipurpose register READ and WRITE capability

• Write leveling

• Self refresh mode

• Low-power auto self refresh (LPASR)

• Temperature controlled refresh (TCR)

• Fine granularity refresh

• Self refresh abort

• Maximum power saving

• Output driver calibration

• Nominal, park, and dynamic on-die termination(ODT)

• Data bus inversion (DBI) for data bus

• Command/Address (CA) parity

• Databus write cyclic redundancy check (CRC)

• Per-DRAM addressability

• Connectivity test

• JEDEC JESD-79-4 compliant2

• sPPR and hPPR capability

• MBIST-PPR support (Die Revision R only)