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Micron MT41K128M16JT-125:K Datesheet

The 1.35V DDR3L SDRAM device is a low-voltage version of the 1.5V DDR3 SDRAM device. Unless statedotherwise, the DDR3L SDRAM device meets the functional and timing specifications listed in the equivalent density standard or automotive DDR3 SDRAMdata sheet located on www.micron.com.The MT41K128M16JT-125:K from Micron is a high-performance DDR3 SDRAM module with a 4Gb density, organized as 16M × 128. It operates at a high data rate of 1600 MT/s and is designed for applications requiring high-speed memory performance, such as computing, networking, and consumer electronics. The device features low power consumption, robust data integrity, and is JEDEC-compliant, ensuring reliability and broad system compatibility. Its standard 1.5V operating voltage and fast CAS latency make it ideal for systems requiring efficient and responsive memory access.

Description:

The 1.35V DDR3L SDRAM device is a low-voltage version of the 1.5V DDR3 SDRAM device. Unless statedotherwise, the DDR3L SDRAM device meets the functional and timing specifications listed in the equivalent density standard or automotive DDR3 SDRAMdata sheet located on www.micron.com.

Features:

• VDD = VDDQ = 1.35V (1.283–1.45V)

• Backward-compatible to VDD = VDDQ = 1.5V ±0.075V

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4(via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• TC of 0°C to +95°C– 64ms, 8192-cycle refresh at 0°C to +85°C– 32ms at +85°C to +95°C

• Self refresh temperature (SRT)

• Automatic self refresh (ASR)

• Write leveling

• Multipurpose register

• Output driver calibration


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