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STMicroelectronics ISM330BX STOCK

The STMicroelectronics ISM330BX is a highly integrated system-in-package inertial measurement unit (IMU) designed for advanced industrial and IoT applications. It combines a 3-axis digital accelerometer and a 3-axis digital gyroscope with triple-channel processing for acceleration and angular rate data, alongside dedicated Qvar electric charge variation sensing on up to three separate channels with independent configuration and filtering. Operating at just 0.6 mA in high-performance combo mode, it enables always-on low-power features for optimal motion experiences. The ISM330BX embeds a comprehensive set of advanced processing capabilities including a programmable Finite State Machine (FSM), Sensor Fusion Low Power (SFLP) algorithm, Adaptive Self-Configuration (ASC), and a Machine Learning Core (MLC) with exportable AI features for IoT applications. With a wide gyroscope range up to ±4000 dps, ultra-low noise accelerometer (down to 30 μg/√Hz over TDM), and multiple interfaces including

Description:

The ISM330BX is a system-in-package inertial measurement unit (IMU) featuring a 

3‑axis digital accelerometer and a 3-axis digital gyroscope with triple channels for 

processing acceleration and angular rate data for motion tracking and vibration 

measurements along with Qvar sensing on up to three separate channels with 

dedicated configuration, processing, and filtering.The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.The ISM330BX embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), adaptive self-configuration (ASC), and machine learning core (MLC) with exportable AI features/filters for IoT applications.The ISM330BX integrates a 6-axis IMU sensor in a compact package (2.5 x 3.0 x 0.71 mm).

Features

• 3-axis accelerometer with selectable full scale: ±2/±4/±8 g

• 3-axis gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps

• 3-axis accelerometer with flat, wide bandwidth (2 kHz) frequency response and low noise (70 μg/√Hz over the SPI/I²C/I3C interface and even down to 30 μg/√Hz over the TDM interface)

• Low supply current in high-performance mode: 0.6 mA in combo mode; 0.19 mA accelerometer only

• SPI / I²C / MIPI I3C® v1.1 serial interface with main processor data synchronization

• TDM controller interface

• Embedded sensor fusion low-power (SFLP) algorithm

• Programmable finite state machine for accelerometer, gyroscope, and analog hub / Qvar sensor data processing with high rate @ 960 Hz

• Machine learning core with exportable features and filters for AI applications

• Embedded adaptive self-configuration (ASC)

• Smart FIFO up to 4.5 KB

• Embedded analog hub for analog-to-digital conversion and processing analog input data

• Embedded Qvar: electric charge variation detection

• Embedded temperature sensor

• Analog supply voltage: 1.71 V to 3.6 V

• Independent IO supply (extended range: 1.08 V to 3.6 V)

• Compact footprint: 2.5 mm x 3 mm x 0.71 mm

• ECOPACK and RoHS compliant

Applications:

• Condition monitoring

• Robotics

• Motion tracking

• White goods

• Hearing aids


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