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STMicroelectronics ISM330DHCX

The STMicroelectronics ISM330DHCX is a system-in-package inertial measurement unit (IMU) specifically engineered for Industry 4.0 and advanced industrial applications. It integrates a high-performance 3D digital accelerometer and 3D digital gyroscope on the same die, delivering superior stability, robustness, and extremely low noise performance. With full-scale acceleration ranges of ±2/±4/±8/±16 g and angular rate ranges up to ±4000 dps, it provides exceptional accuracy across diverse operating conditions from -40°C to +105°C. The ISM330DHCX features an unprecedented set of embedded intelligence including a Machine Learning Core (MLC), programmable Finite State Machine (FSM), Sensor Hub for external sensor data collection, and a 9 KB smart FIFO. These advanced capabilities enable complex sensor node implementations at very low power, supporting applications such as vibration monitoring, industrial automation, robotics, and optical image stabilization. The device includes comprehensive

Description:

The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and a 3D digital gyroscope tailored for Industry 4.0 applications. ST's MEMS sensor module series leverages robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology, allowing the design of dedicated circuits which are trimmed to better match the sensing element characteristics.

In the ISM330DHCX, the sensing elements for both the accelerometer and the gyroscope are implemented on the same die, thus guaranteeing superior stability and robustness. The ISM330DHCX features full-scale acceleration ranges of ±2/±4/±8/±16 g and angular rate ranges of ±125/±250/±500/±1000/±2000/±4000 dps, making it suitable for a wide variety of applications. Every design and calibration aspect of the ISM330DHCX has been optimized to achieve very high accuracy, stability, extremely low noise, and complete data synchronization. An unprecedented set of embedded features (Machine Learning Core, programmable FSM, FIFO, Sensor Hub, event decoding, and interrupts) enables the implementation of smart and complex sensor nodes that deliver high performance at very low power. The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

Features:

• 3D accelerometer with selectable full scales: ±2/±4/±8/±16 g

• 3D gyroscope with extended selectable full scales: ±125/±250/±500/±1000/±2000/±4000 dps

• Extended temperature range: -40 °C to +105 °C

• Embedded compensation for high stability over temperature

• SPI / I²C serial interface

• Auxiliary SPI serial interface for data output from gyroscope and accelerometer (for OIS and other stabilization applications)

• Six-channel synchronized output

• Sensor Hub capability to efficiently collect data from additional external sensors

• Smart embedded FIFO up to 9 KB

• Programmable finite state machine for processing data from the accelerometer, gyroscope, and an external sensor

• Machine Learning Core

• Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D

orientation detection, single and double-tap

• Embedded pedometer, step detector, and step counter for healthcare applications

• Analog supply voltage: 1.71 V to 3.6 V

• Embedded temperature sensor

• Embedded self-test for both gyroscope and accelerometer

• High shock survivability

• Complies with ECOPACK, RoHS, and "Green" requirements

Applications:

• Industrial IoT and connected devices

• Antenna, platform, and optical image and lens stabilization

• Robotics, drones, and industrial automation

• Navigation systems and telematics

• Vibration monitoring and compensation


How to Order

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